AD9371BBCZ datasheet(13/60 Pages) AD

13 / 60 page

Data Sheet

AD9371

Rev. A | Page 13 of 60

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

VDDA_1P31 to VSSA

−0.3 V to +1.4 V

VDDA_SER, VDDA_DES, and

JESD_VTT_DES to VSSA

−0.3 V to +1.4 V

VDIG to VSSD

−0.3 V to +1.4 V

VDDA_1P8 to VSSA

−0.3 V to +2.0 V

VDD_IF to VSSA

−0.3 V to +3.0 V

VDDA_3P3 to VSSA

−0.3 V to +3.9 V

Logic Inputs and Outputs to VSSD

−0.3 V to VDD_IF + 0.3 V

JESD204B Logic Outputs to VSSA

−0.3 V to VDDA_SER

JESD204B Logic Inputs to VSSA

−0.3 V to VDDA_DES

Input Current to Any Pin Except

Supplies

±10 mA

Maximum Input Power into RF Ports

(Excluding Sniffer Receiver Inputs)

23 dBm (peak)

Maximum Input Power into SNRXA±,

SNRXB±, and SNRXC±

2 dBm (peak)

Maximum Junction Temperature (TJ MAX)

110°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

1 VDDA_1P3 refers to all analog 1.3 V supplies: VDDA_BB, VDDA_CLKSYNTH,

VDDA_TXLO, VDDA_RXSYNTH, VDDA_RXVCO, VDDA_RXTX, VDDA_RXRF,

VDDA_TXSYNTH, VDDA_TXVCO, VDDA_CALPLL, VDDA_SNRXSYNTH,

VDDA_SNRXVCO, VDDA_CLK, and VDDA_RXLO.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9371 reflow profile is in accordance with the JEDEC

JESD20 criteria for Pb-free devices. The maximum reflow

temperature is 260°C.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and

operating environment. Careful attention to PCB thermal

design is required.

Table 5. Thermal Resistance

Package

Airflow

Velocity1 (m/sec)

θJA2,3 (°C/W)

θJC2,4 (°C/W)

BC-196-12

JEDEC5

0.0

20.5

0.05

1.0

18.5

N/A6

2.5

17.2

N/A6

10-Layer PCB

0.0

14.1

0.05

1.0

12.4

N/A6

2.5

11.6

N/A6

1 Power dissipation is 3.0 W for all test cases.

2 Per JEDEC JESD51-7 for JEDEC JESD51-5 2S2P test board.

3 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

4 Per MIL-STD 883, Method 1012.1.

5 JEDEC entries refer to the JEDEC JESD51-9 (high K thermal test board).

6 N/A means not applicable.

ESD CAUTION

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