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LM61 bảng dữ liệu(PDF) 6 Page - National Semiconductor (TI) |
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LM61 bảng dữ liệu(HTML) 6 Page - National Semiconductor (TI) |
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6 / 9 page ![]() 1.0 Mounting (Continued) 2.0 Capacitive Loads The LM61 handles capacitive loading well. Without any spe- cial precautions, the LM61 can drive any capacitive load as shown in Figure 4. Over the specified temperature range the LM61 has a maximum output impedance of 5 k Ω.Inanex- tremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 µF be added from +V S to GND to bypass the power sup- ply voltage, as shown in Figure 5. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 µF output capacitor with the 5 k Ω maximum out- put impedance will form a 32 Hz lowpass filter. Since the thermal time constant of the LM61 is much slower than the 5 ms time constant formed by the RC, the overall response time of the LM61 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM61. SOT-23* SOT-23** TO-92* TO-92*** no heat sink small heat fin no heat sink small heat fin θ JA T J −TA θ JA T J −TA θ JA T J −TA θ JA T J −TA (˚C/W) (˚C) (˚C/W) (˚C) (˚C/W) (˚C) (˚C/W) (˚C) Still air 450 0.26 260 0.13 180 0.09 140 0.07 Moving air 180 0.09 90 0.05 70 0.03 *Part soldered to 30 gauge wire. **Heat sink used is 1⁄2" square printed circuit board with 2 oz. foil with part attached as shown in Figure 2. ***Part glued and leads soldered to 1 ″ square of 1/16″ printed circuit board with 2oz. foil or similar. FIGURE 3. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance ( θ JA) DS012897-15 FIGURE 4. LM61 No Decoupling Required for Capacitive Load DS012897-16 FIGURE 5. LM61 with Filter for Noisy Environment DS012897-17 FIGURE 6. Simplified Schematic www.national.com 6 |
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