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PZT751T1G. bảng dữ liệu(PDF) 1 Page - ON Semiconductor |
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PZT751T1G. bảng dữ liệu(HTML) 1 Page - ON Semiconductor |
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1 / 4 page ![]() © Semiconductor Components Industries, LLC, 2015 January, 2015 − Rev. 9 1 Publication Order Number: PZT751T1/D PZT751 PNP Silicon Planar Epitaxial Transistor This PNP Silicon Epitaxial transistor is designed for use in industrial and consumer applications. The device is housed in the SOT−223 package which is designed for medium power surface mount applications. Features • High Current • The SOT−223 Package can be soldered using wave or reflow. • SOT−223 Package Ensures Level Mounting, Resulting in Improved Thermal Conduction, and Allows Visual Inspection of Soldered Joints. The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die • NPN Complement is PZT651T1G • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant* MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Value Unit Collector−Emitter Voltage VCEO −60 Vdc Collector−Base Voltage VCBO −80 Vdc Emitter−Base Voltage VEBO −5.0 Vdc Collector Current IC −2.0 Adc Total Power Dissipation @ TA = 25°C (Note 1) Derate above 25 °C PD 0.8 6.4 W mW/ °C Storage Temperature Range Tstg − 65 to 150 °C Junction Temperature TJ 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Device mounted on a FR−4 glass epoxy printed circuit board using minimum recommended footprint. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance from Junction−to− Ambient in Free Air RqJA 156 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 10 °C Sec *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com SOT−223 PACKAGE HIGH CURRENT NPN SILICON TRANSISTOR SURFACE MOUNT SOT−223 CASE 318E STYLE 1 COLLECTOR 2, 4 BASE 1 EMITTER 3 Device Package Shipping† ORDERING INFORMATION PZT751T1G SOT−223 (Pb−Free) 1,000 / Tape & Reel MARKING DIAGRAM A = Assembly Location Y = Year W = Work Week G = Pb−Free Package †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 AYW ZT751 G G (Note: Microdot may be in either location) SPZT751T1G SOT−223 (Pb−Free) 1,000 / Tape & Reel 1 2 3 4 |
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