STS30 datasheet(12/17 Pages) ETC2

12 / 17 page

www.sensirion.com

November 2016 - Version 1

12/17

5 Packaging

STS3x-DIS sensors are provided in a dual flat no leads

(DFN) package.

The sensor chip is made of silicon and is mounted to a

lead frame. The latter is made of Cu plated with

Ni/Pd/Au. Chip and lead frame are overmolded by an

epoxy-based mold compound leaving the central die pad

and I/O pins exposed for mechanical and electrical

connection. Please note that the side walls of the sensor

are diced and therefore these diced lead frame surfaces

are not covered with the respective plating.

The package follows JEDEC publication 95, design

registration 4.20, small scale plastic quad and dual inline,

square and rectangular, No-LEAD packages (with

optional

thermal

enhancements)

small

scale

(QFN/SON), Issue D.01, September 2009.

STS3x-DIS has a Moisture Sensitivity Level (MSL) of 1,

according to IPC/JEDEC J-STD-020. At the same time,

it is recommended to further process the sensors within

1 year after date of delivery.

5.1

Traceability

All STS3x-DIS sensors are laser marked for easy

identification and traceability. The marking on the sensor

top side consists of a pin-1 indicator and two lines of text.

The top line consist of the pin-1 indicator which is located

in the top left corner and the product name. The small

letter x stands for the accuracy class.

The bottom line consists of 6 letters. The first two digits

XY (=DI) describe the output mode. The third letter (A)

represents the manufacturing year (4 = 2014, 5 = 2015,

etc). The last three digits (BCD) represent an

alphanumeric tracking code. That code can be decoded

by Sensirion only and allows for tracking on batch level

through production, calibration and testing – and will be

provided upon justified request.

If viewed from below pin 1 is indicated by triangular

shaped cut in the otherwise rectangular die pad. The

dimensions of the triangular cut are shown in Figure 7

through the labels T1 & T2.

Figure 6 Top View of the STS3x-DIS illustrating the laser

marking.

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