| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
LM4882 bảng dữ liệu(PDF) 8 Page - National Semiconductor (TI) |
|
|
|
|||||||||||||||||||||||||||||
LM4882 bảng dữ liệu(HTML) 8 Page - National Semiconductor (TI) |
|
8 / 12 page ![]() Application Information SHUTDOWN FUNCTION In order to reduce power consumption while not in use, the LM4882 contains a shutdown pin to externally turn off the amplifier’s bias circuitry. This shutdown features turns the amplifier off when a logic high is placed on the shutdown pin. The trigger point between a logic low and logic high level is typically half supply. It is best to switch between ground and supply to provide maximum device performance. By switch- ing the shutdown pin to the V DD, the LM4882 supply current draw will be minimized in idle mode. While the device will be disabled with shutdown pin voltages less than V DD, the idle current may be greater than the typical value of 0.5 µA. In ei- ther case, the shutdown pin should be tied to a definite volt- age because leaving the pin floating may result in an un- wanted shutdown condition. In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry which provides a quick smooth transi- tion into shutdown. Another solution is to use a single-pole, single-throw switch in conjunction with an external pull-up re- sistor. When the switch is closed, the shutdown pin is con- nected to ground and enables the amplifier. If the switch is open, then the external pull-up resistor will disable the LM4882. This scheme guarantees that the shutdown pin will not float which will prevent unwanted state changes. POWER DISSIPATION Power dissipation is a major concern when using any power amplifier and must be thoroughly understood to ensure a successful design. Equation 1 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. P DMAX =(VDD) 2/(2 π2R L) (1) Even with this internal power dissipation, the LM4882 does not require heat sinking over a large range of ambient tem- perature. From Equation 1, assuming a 5V power supply and an 4 Ω load, the maximum power dissipation point is 316 mW. The maximum power dissipation point obtained must not be greater than the power dissipation that results from Equation 2: P DMAX =(TJMAX−T A)/θJA (2) For the LM4882 surface mount package, θ JA = 210˚C/W and T JMAX = 150˚C. Depending on the ambient temperature, TA, of the system surroundings, Equation 2 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 1 is greater than that of Equation 2, then either the supply voltage must be de- creased, the load impedance increased or T A reduced. For the typical application of a 5V power supply, with an 4 Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 83˚C provided that device operation is around the maximum power dissipation point. Power dissipation is a function of output power and thus, if typical operation is not around the maximum power dissipation point, the ambient temperature may be increased accordingly. Refer to the Typical Perfor- mance Characteristics curves for power dissipation infor- mation for lower output powers. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is criti- cal for low noise performance and high power supply rejec- tion. The capacitor location on both the bypass and power supply pins should be as close to the device as possible. As displayed in the Typical Performance Characteristics sec- tion, the effect of a larger half supply bypass capacitor is im- proved low frequency PSRR due to increased half-supply stability. Typical applications employ a 5V regulator with 10 µF and a 0.1 µF bypass capacitors which aid in supply stability, but do not eliminate the need for bypassing the sup- ply nodes of the LM4882. The selection of bypass capaci- tors, especially C B, is thus dependent upon desired low fre- quency PSRR, click and pop performance as explained in the section, Proper Selection of External Components section, system cost, and size constraints. PROPER SELECTION OF EXTERNAL COMPONENTS Selection of external components when using integrated power amplifiers is critical to optimize device and system performance. While the LM4882 is tolerant of external com- ponent combinations, consideration to component values must be used to maximize overall system quality. The LM4882 is unity gain stable and this gives a designer maximum system flexibility. The LM4882 should be used in low gain configurations to minimize THD+N values, and maximize the signal to noise ratio. Low gain configuartions require large input signals to obtain a given output power. In- put signals equal to or greater than 1 Vrms are available from sources such as audio codecs. Please refer to the sec- tion, Audio Power Amplifier Design, for a more complete explanation of proper gain selection. Besides gain, one of the major considerations is the closed loop bandwidth of the amplifier. To a large extent, the band- width is dictated by the choice of external components shown in Figure 1. Both the input coupling capacitor, C i, and the output coupling capacitor, C o, form first order high pass filters which limit low frequency response. These values should be chosen based on needed frequency response for a few distinct reasons. CLICK AND POP CIRCUITRY The LM4882 contains circuitry to minimize turn-on and turn- off transients or “clicks and pops.” In this case, turn-on refers to either power supply turn-on or the device coming out of shutdown mode. When the device is turning on, the amplifi- ers are internally muted. An internal current source ramps up the voltage of the bypass pin. Both the inputs and outputs track the voltage at the bypass pin. The device will remain muted until the bypass pin has reached its half supply volt- age, 1/2 V DD. As soon as the bypass node is stable, the de- vice will become fully operational, where the gain is set by the external resistors. Although the bypass pin current source cannot be modified, the size of C B can be changed to alter the device turn-on time and the level of “clicks and pops.” By increasing the value of C B, the level of turn-on pop can be reduced. How- ever, the tradeoff for using a larger bypass capacitor is an in- crease in turn-on time for the device. There is a linear rela- tionship between the size of C B and the turn-on time. Here are some typical turn-on times for a given C B: C B T ON 0.01 µF 20 ms 0.1 µF 200 ms 0.22 µF 420 ms 0.47 µF 900 ms In order to eliminate “clicks and pops,” all capacitors must be discharged before turn-on. Rapid on/off switching of the de- www.national.com 8 |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |