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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

R7004_UA2_UB2 • 2/27/2014

Miniature Signal Relays – UA2/UB2 Series

Soldering Process

UA2 – Through-hole Mounting

Automatic Soldering

Preheating: 110–120°C / 110 seconds (maximum)

Solder temperature: 260°C maximum

Solder time: 5 seconds maximum

Note: KEMET recommends cooling down a printed circuit board to less than 110°C within 40 seconds after soldering.

Manual Soldering

Solder temperature: 350°C maximum

Solder time: 3 seconds maximum

UB2 – Surface Mounting

Note:

Temperatureprofileshowsprintedcircuitboardsurfacetemperatureontherelayterminalportion.

PleaseconsultKEMETifyouwishtouseatemperatureprofileotherthanabove.

IRS Method

200

180

190 (Maximum 300)

45 (Maximum 70)

70 (Maximum 120)

220

200

180

Temperature

(˚C)

220

Maximum 240˚C

Time (seconds)