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ACTF9022/900.0/DCC6 bảng dữ liệu(PDF) 3 Page - Advanced Crystal Technology |
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ACTF9022/900.0/DCC6 bảng dữ liệu(HTML) 3 Page - Advanced Crystal Technology |
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3 / 3 page ![]() Tel : +44 118 979 1238 Fax : +44 118 979 1283 Email: info@actcrystals.com In keeping with our ongoing policy of product evolvement and improvement, the above specification is subject to change without notice. ISO9001: 2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK http://www.actcrystals.com 5-2.Electronic Characteristics Parameter Minimum Typical Maximum Unit Centre Frequency fC -- 900.000 -- MHz 3dB Bandwidth BW3 -- ±19 -- MHz Usable Bandwidth BWUSE -- ±15 -- MHz Insertion Loss IL 885.00 MHz …. 915.00 MHz -- 2.7 3.6 dB Amplitude Variation (p-p) Δ α 885.00 MHz …. 915.00 MHz -- 1.0 1.8 dB Absolute Attenuation α DC …. 840.00 MHz 930.00 MHz …. 960.00 MHz 990.00 MHz …. 2000.0 MHz 48 20 48 57 28 58 -- -- -- dB Input / Output Impedance 50 Ω iCAUTION: Electrostatic Sensitive Device. Observe precautions for handling! 1. The frequency fC is defined as the midpoint between the 3dB frequencies. 2. Unless noted otherwise, all measurements are made with the filter installed in the specified test fixture that is connected to a 50 Ω test system with VSWR≤1.2:1. The test fixture L and C are adjusted for minimum insertion loss at the filter centre frequency, f C. Note that insertion loss, bandwidth, and passband shape are dependent on the impedance matching component values and quality. 3. Unless noted otherwise, specifications apply over the entire specified operating temperature range. 4. The specifications of this device are based on the test circuit shown above and subject to change or obsolescence without notice. 5. All equipment designs utilizing this product must be approved by the appropriate government agency prior to manufacture or sale. 6. Our liability is only assumed for the Surface Acoustic Wave (SAW) component(s) per se, not for applications, processes and circuits implemented within components or assemblies. Issue : 1.1 C1 Date : March 2010 |
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