CHC Series Issue April 2011 Sheet 3 of 4

• 4222 South Staples Street • Corpus Christi Texas 78411 USA

© IRC Advanced Film Division

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com

Physical Data and Schematic Diagrams for 1.0mm Pitch Series

0.64mm ±0.05 diameter

solder bumps

1.00mm

±0.25mm

4.0mm

±0.15mm

0.63m m

±0.1mm

0.50mm

±0.25mm

1.00mm

±0.25mm

9.00mm

±0.15mm

1

2

3

9

8

7

6

5

4

1.27m m

±0.16mm

1

2

3

4

5

6

7

8

9

D

C

B

A

1

2

3

4

5

6

7

8

9

D

C

B

A

CD0910A isolated schematic

(view from top)

CD0910B bussed schematic

(view from top)

1.00m m

±0.25mm

3.0m m

±0.15mm

0.50mm

±0.25mm

1.00m m

±0.25mm

9.00m m

±0.15mm

1

2

3

9

8

7

6

5

4

0.63m m

±0.1mm

1.27m m

±0.16m m

0.64mm ±0.05 diameter

solder bump s

1

2

3

4

5

6

7

8

9

C

B

A

1

2

3

4

5

6

7

8

9

C

B

A

CC0910A isolated schematic

(view from top)

CC0910B bussed schematic

(view from top)

Ceramic Ball Grid

Termination Arrays

Environmental Test

Specification

Typical

Maximum

Thermal shock

MIL-PRF-83401

±0.01%

±0.02%

Low temperature operation

MIL-PRF-83401

±0.01%

±0.05%

Short time overload

MIL-PRF-83401

±0.01%

±0.05%

High temperature exposure

MIL-PRF-83401

±0.03%

±0.05%

Effects of solder

MIL-PRF-83401

±0.01%

±0.05%

Moisture resistance

MIL-STD-202, Method 206

65°C, 45% RH, with bias

±0.02%

±0.01%

Life

MIL-PRF-83401

±0.01%

±0.02%

Environmental Data

Note: Contact A1 indicator marked with dot on top of part. Coplanarity between solder bumps 0.06mm.

Ceramic Ball Grid

Termination Arrays

CHC Series

Make Possible

07.14

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronicsresistors.com