If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage

22V

Peak Current

1.3A

Package Dissipation 14-Pin DIP (Note 7)

8.3W

Package Dissipation 8-Pin DIP (Note 7)

1.67W

Input Voltage

Storage Temperature

−65˚C to +150˚C

Operating Temperature

0˚C to +70˚C

Junction Temperature

+150˚C

Lead Temperature (Soldering, 10 sec.)

+260˚C

ESD rating to be determined

Thermal Resistance

θ

30˚C/W

θ

37˚C/W

θ

79˚C/W

θ

107˚C/W

Symbol

Parameter

Conditions

Min

Typ

Max

Units

P

OUT(RMS)

Output Power

R

2.5

W

A

V

Gain

40

50

60

V/V

V

OUT

Output Voltage Swing

R

14

V

p-p

Z

IN

Input Resistance

150k

Ω

THD

Total Harmonic Distortion

(Notes 5, 6)

0.2

%

PSRR

Power Supply Rejection Ratio

(Note 3)

38

dB

V

S

Supply Voltage

10

22

V

BW

Bandwidth

P

100k

Hz

I

Q

Quiescent Supply Current

7

25

mA

V

OUTQ

Quiescent Output Voltage

8

9.0

10

V

I

BIAS

Bias Current

Inputs Floating

100

nA

I

SC

Short Circuit Current

1.3

A

Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits.

Note 4: With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16" epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square inches.

Note 6: The maximum junction temperature of the LM380 is 150˚C.

Note 7: The package is to be derated at 15˚C/W junction to heat sink pins for 14-pin pkg; 75˚C/W for 8-pin.

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