MIC5200 datasheet(13/24 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

DS20005578A-page 13

MIC5200

5.0

THERMAL CONSIDERATIONS

5.1

Layout

The MIC5200-x.xYM (8-pin surface mount package)

has the following thermal characteristics when

mounted on a single-layer copper-clad printed circuit

board.

Multi-layer boards having a ground plane, wide traces

near the pads, and large supply bus lines provide better

thermal conductivity.

The "worst case" value of 160 °C/W assumes no

ground plane, minimum trace widths, and a FR4

material board.

5.2

Nominal Power Dissipation and

Die Temperature

The MIC5200-x.xYM at a 25°C ambient temperature

will operate reliably at up to 625 mW power dissipation

when mounted in the "worst case" manner described

above. At an ambient temperature of 55°C, the device

may safely dissipate 440 mW. These power levels are

equivalent to a die temperature of 125°C, the

recommended maximum temperature for non-military

grade silicon integrated circuits.

For MIC5200-x.xYS (SOT-223 package) heat sink

characteristics, please refer to Application Hint 17,

“Calculating P.C. Board Heat Sink Area for Surface

Mount Packages”.

PC Board Dielectric



FR4

160 °C/W

Ceramic

120 °C/W

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