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MLX92241 bảng dữ liệu(PDF) 13 Page - Melexis Microelectronic Systems

tên linh kiện MLX92241
Giải thích chi tiết về linh kiện  2-Wire Hall Effect Switch
PDF  16 Pages
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nhà sản xuất  MELEXIS [Melexis Microelectronic Systems]
Trang chủ  http://www.melexis.com
Logo MELEXIS - Melexis Microelectronic Systems

MLX92241 bảng dữ liệu(HTML) 13 Page - Melexis Microelectronic Systems

Back Button MLX92241 Datasheet HTML 8Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 9Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 10Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 11Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 12Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 13Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 14Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 15Page - Melexis Microelectronic Systems MLX92241 Datasheet HTML 16Page - Melexis Microelectronic Systems  
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MLX92241-AAA
2-Wire Hall Effect Switch
390109224100 Rev. 1
Page 13 of 16
June/13
9 Standard information regarding manufacturability of Melexis products
with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture
sensitivity level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave
Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic-
encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering
THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability
SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed
upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
http://www.melexis.com/Assets/Soldering-Application-Note-and-Recommendations-5446.aspx
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the
use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
10 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.



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