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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).

2. TYPICAL BOND PAD IS .004” SQUARE.

3. TYPICAL BOND PAD SPACING IS .006” CENTER

TO CENTER EXCEPT AS NOTED.

4. BACKSIDE METALIZATION: GOLD

5. BACKSIDE METAL IS GROUND

6. BOND PAD METALIZATION: GOLD

Pad Number

Function

Description

Interface Schematic

GND

Die bottom must be connected to RF ground.

1, 3

RF1, RF2

This pad is DC coupled and matched to 50 Ohm.

Blocking capacitors are required.

2Vdd

Supply Voltage

4, 5, 6, 7, 8, 9

V1 - V6

See truth table and control voltage table.

Pad Descriptions

HMC425

0.5 dB LSB GaAs MMIC 6-BIT DIGITAL

POSITIVE CONTROL ATTENUATOR, 2.4 - 8.0 GHz

v02.0907