LM2937 datasheet(4/11 Pages) NSC

4 / 11 page

Electrical Characteristics

IN =VNOM + 5V, (Note 4) IOUTmax = 500 mA for the TO-220 and TO-263 packages, IOUTmax=400mA for the SOT-223 pack-

age, C

OUT = 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the

indicted device., all other specifications are for T

A =TJ = 25˚C.

Output Voltage (V

OUT)

12V

15V

Units

Parameter

Conditions

Typ

Limit

Typ

Limit

Output Voltage

5 mA

≤ I

OUT ≤ IOUTmax

11.64

14.55

V (Min)

12.00

11.40

15.00

14.25

V(Min)

12.36

15.45

V(Max)

12.60

15.75

V(Max)

Line Regulation

OUT + 2V) ≤ VIN ≤ 26V,

120

150

mV(Max)

OUT =5 mA

Load Regulation

5 mA

≤ I

OUT ≤ IOUTmax

120

150

mV(Max)

Quiescent Current

OUT + 2V) ≤ VIN ≤ 26V,

mA(Max)

OUT =5 mA

IN =(VOUT + 5V),

mA(Max)

OUT =IOUTmax

Output Noise

10 Hz–100 kHz,

360

450

µVrms

Voltage

OUT =5 mA

Long Term Stability

1000 Hrs.

Dropout Voltage

OUT =IOUTmax

0.5

1.0

0.5

1.0

V(Max)

OUT = 50 mA

110

250

110

250

mV(Max)

Short-Circuit Current

1.0

0.6

1.0

0.6

A(Min)

Peak Line Transient

f < 100 ms, RL = 100Ω

V(Min)

Voltage

Maximum Operational

V(Min)

Input Voltage

Reverse DC

OUT ≥ −0.6V, RL = 100Ω

−30

−15

−30

−15

V(Min)

Input Voltage

Reverse Transient

r < 1 ms, RL = 100Ω

−75

−50

−75

−50

V(Min)

Input Voltage

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device

outside of its rated Operating Conditions.

Note 2: The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for op-

eration, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C

and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the

junction-to-ambient thermal resistance

θJA is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used

with a heatsink,

θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263

or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application

Hints for more information on heatsinking).

Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 k

Ω.

Note 4: Typicals are at TJ = 25˚C and represent the most likely parametric norm.

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