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LCMC bảng dữ liệu(PDF) 13 Page - AVX Corporation |
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LCMC bảng dữ liệu(HTML) 13 Page - AVX Corporation |
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13 / 13 page ![]() 20 Quantity per reel 0201: 15,000 pieces / reel 0402: 10,000 pieces / reel 0603: 4,000 pieces / reel The contents of a box 0201: 5 reels / box 0402: 5 reels / box 0603: 5 reels / box Marking The following item shall be marked on the reel. a. Manufactures parts number. b. Manufacturing date code. c. Manufacturer name. d. Manufactures lot number. e. Quantity. CAUTIONS Storage The chip inductor shall be packaged in carrier tapes. To keep storage place temperature from +5 to 35ºC, humidity from 45 to 70% RH. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be affected. The solderability is assured for 12 months from our final inspection date if the above storage condition is followed. Handling Chip inductor should be handled with care to avoid contamination or damage. The use of vacuum pick-up or plastic tweezers is recommended for manual placement. Tape and reeled packages are suitable for automatic pick and placement machine. Recommended pad dimensions Soldering Profile for SMT Process with SnPb Solder Paste The rate of preheat should not exceed 4ºC/sec. and a target of 2ºC/sec. is preferred. Ceramic chip components should be preheated to within 100 to 130ºC of the soldering. Soldering Profile for SMT Process with Lead Free Solder Paste The rate of preheat should not exceed 4ºC/sec. and a target of 2ºC/sec. is preferred. Ceramic chip components should be preheated to within 100 to 130ºC of the soldering. Soldering 220°C to 230°C 5 ~ 10 sec. Gradual Natural Cooling Preheating over 1 min over 1 min Time (sec.) Over 200°C, within 40 sec. 120 sec max 300 200 0 250 Soldering 240°C to 260°C 5 ~ 10 sec. Gradual Natural Cooling Preheating over 1 min over 1 min Time (sec.) Over 200°C, within 90 sec. 120 sec max 0 300 200 250 c a b Soldering resist SMD Inductor Land Pattern Size (EIA) L x W a b c 0201 0.60 x 0.30 0.15 to 0.35 0.20 to 0.30 0.25 to 0.30 (0.024 x 0.012) (0.006 to 0.014) (0.008 to 0.012) (0.010 to 0.012) 0402 1.00 x 0.50 0.30 to 0.50 0.35 to 0.45 0.40 to 0.50 (0.039 x 0.020) (0.012 to 0.020) (0.014 to 0.018) (0.016 to 0.020) 0603 1.60 x 0.80 0.70 to 1.00 0.60 to 0.80 0.70 to 0.80 (0.063 x 0.031) (0.028 to 0.039) (0.024 to 0.031) (0.028 to 0.031) mm (inches) Multi-Layer High Frequency Ceramic Chip Inductors LCMC Series |
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