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HDF1178AS7 bảng dữ liệu(PDF) 5 Page - Shoulder Electronics Limited.

tên linh kiện HDF1178AS7
Giải thích chi tiết về linh kiện  This specification shall cover the characteristics of SAW filter with HDF1178A used for the page system
PDF  9 Pages
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nhà sản xuất  SHOULDER [Shoulder Electronics Limited.]
Trang chủ  http://www.shoulder.cn/
Logo SHOULDER - Shoulder Electronics Limited.

HDF1178AS7 bảng dữ liệu(HTML) 5 Page - Shoulder Electronics Limited.

  HDF1178AS7 Datasheet HTML 1Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 2Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 3Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 4Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 5Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 6Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 7Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 8Page - Shoulder Electronics Limited. HDF1178AS7 Datasheet HTML 9Page - Shoulder Electronics Limited.  
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SAW FILTER
HDF1178A S-7
www.shoulder.cn
Tel:0755-82916880
Fax:0755-82916881
E-mail:info@shoulder.cn
Page 5 of 9
4.DIMENSION
Marking:HDF7G26
HD: Brand
F : Filter
7 : SMD-7
G26 : No.
5. ENVIRONMENTAL CHARACTERISTICS
5-1 High temperature exposure
Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-2 Low temperature exposure
Subject the device to -40℃ for 16 hours. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall fulfill the specifications in 2.2.
5-3 Temperature cycling
Subject the device to a low temperature of -40℃for 30 minutes. Following by a high
temperature of +85℃ for 30 Minutes. Then release the device into the room conditions
for 24 hours prior to the measurement. It shall meet the specifications in 2.2.
5-4 Resistance to solder heat
Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for
10±1 sec. Then release the device into the room conditions for 4 hours. The device shall
meet the specifications in 2.2.
5-5 Solderability



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