Rev 1.5

vicorpower.com

Page 14 of 15

08/2015

800 927.9474

QPI-21

QPI-21 PCB Layout Recommendations

Figure 24 — 3D view of paralleling planes underneath the QPI-21

PCB Layout

When laying out the QPI-21 EMI filter it is important for the designer

to be aware of the radiated EMI field that all converters emit and to

place the QPI-21 outside of this field area. It is also recommended

that the bus lines feeding into the QPI filter are not routed such that

they lie between the QPI and the converter, or that their copper

planes over-lap on inner layers. This can cause EMI noise to be

coupled from input to output via the parasitic capacitance between

the planes.

When using converters that have a large field of radiated EMI

surrounding them, the QPI-21 must be located outside of this area of

radiation, with the BUS voltage pins located on the side farthest away

from the converter. This is to keep the radiated EMI from by-passing

the filter and coupling directly to the BUS feeds.

Post Solder Cleaning

The LZ version QP SIPs are not hermetically sealed and must not be

exposed to liquid, including but not limited to cleaning solvents,

aqueous washing solutions or pressurized sprays. When soldering, it

is recommended that no-clean flux solder be used, as this will ensure

that potentially corrosive mobile ions will not remain on, around, or

under the module following the soldering process. For applications

where the end product must be cleaned in a liquid solvent, Picor

recommends using the QPI-21LZ-01, open-frame version of the

EMI filter.

QPI-21 Mechanical Data

Datum

Units

QPI-21LZ

QPI-21LZ-01

Notes

FITS

Failure/Billion Hrs.

208

208

FITS based on the BellCore Standard TR-332

MTBF

Million Hrs.

4.8

4.8

MTBFs based on the BellCore Standard TR-332

Weight

grams

6.5

5.2

MSL

3

3

Peak reflow Temperature

°C/20 seconds

245

245

IPC/JEDEC J-STD-020D