SAW FILTER

HDF403C

S4

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Page 5 of 8

Subject the device to +85℃ for 16 hours. Then release the filter into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.

5-2 Low temperature exposure

Subject the device to -20℃ for 16 hours. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall fulfill the specifications in table 1.

5-3 Temperature cycling

Subject the device to a low temperature of -40℃for 30 minutes. Following by a high

temperature of +80℃ for 30 Minutes. Then release the device into the room conditions

for 24 hours prior to the measurement. It shall meet the specifications in table 1.

5-4 Resistance to solder heat

Dip the device terminals no closer than 1.5mm into the solder bath at 260℃ ±10℃ for

10±1 sec. Then release the device into the room conditions for 4 hours. The device shall

meet the specifications in table 1.

5-5 Solderability

Subject the device terminals into the solder bath at 245℃ ±5℃ for 5s, More than 95%

area of the terminals must be covered with new solder. It shall meet the specifications in

table 1.

5-6 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1m 3 times. the

device shall fulfill the specifications in table 1.

5-7 Vibration

Subject the device to the vibration for 1 hour each in x,y and z axes with the amplitude of

1.5 mm at 10 to 55 Hz. The device shall fulfill the specifications in

table 1.

5-8 Lead fatigue

5-8-1 Pulling test

Weight along with the direction of lead without an shock 1kg. The device shall satisfy all

the initial Characteristics.

5-8-2 Bending test

Lead shall be subject to

withstand

against 90℃ bending with 450g weight in the

direction of thickness. This operation shall be done toward both direction. The device shall

show no evidence of damage and shall satisfy all the initial electrical characteristics.

6. REMARK

6.1 Static voltage

Static voltage between signal load & ground may cause deterioration &destruction of

the component. Please avoid static voltage.

6.2 Ultrasonic cleaning

Ultrasonic vibration may cause deterioration & destruction of the component. Please

avoid ultrasonic cleaning

6.3 Soldering

Only leads of component may be soldered. Please avoid soldering another part of

component.