SAW FILTER

HDF325A

SMD-3

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2. TEST CIRCUIT

4. DIMENSION

5. ENVIRONMENTAL CHARACTERISTICS

5-1 Temperature cycling

Subject the device to a low temperature of -40℃for 30 minutes. Following by a high

temperature of +25℃ for 5 Minutes and a higher temperature of +85℃ for 30 Minutes.

Then release the device into the room conditions for 1 to 2 hours prior to the measurement.

It shall meet the specifications in 2-2.

5-2 Resistance to solder heat

Submerge the device terminals into the solder bath at 260℃±5℃ for 10±1 sec.

Then release the device into the room conditions for 4 hours. It shall meet the specifications

in 2-2.

5-3 Solderability

Submerge the device terminals into the solder bath at 245℃±5℃ for 5s, More than

95% area of the soldering pad must be covered with new solder. It shall meet the

specifications in 2-2.

5-4 Mechanical shock

Drop the device randomly onto the concrete floor from the height of 1 m 3 times. the

1.Ground

2.Input/output

3.Ground

4.Ground

5.Ground

6.Input/output

7.Ground

8.Ground