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MCP8026 bảng dữ liệu(PDF) 59 Page - Microchip Technology

tên linh kiện MCP8026
Giải thích chi tiết về linh kiện  3-Phase Brushless DC (BLDC) Motor Gate Driver with Power Module, Sleep Mode, and LIN Transceiver
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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MCP8026 bảng dữ liệu(HTML) 59 Page - Microchip Technology

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 2016 Microchip Technology Inc.
DS20005339B-page 59
MCP8025/6
Microchip Technology Drawing C04-183A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP] With Exposed Pad
H
L
(L1)
c
SECTION A-A
2.
1.
4.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3.
protrusions shall not exceed 0.25mm per side.
Mold Draft Angle Bottom
Molded Package Thickness
Dimension Limits
Mold Draft Angle Top
Notes:
Foot Length
Lead Width
Lead Thickness
Molded Package Length
Molded Package Width
Overall Length
Overall Width
Foot Angle
Footprint
Standoff
Overall Height
Lead Pitch
Number of Leads
12°
11°
13°
0.75
0.60
0.45
L
12°
0.22
7.00 BSC
7.00 BSC
9.00 BSC
9.00 BSC
3.5°
1.00 REF
c
b
D1
E1
0.09
0.17
11°
D
E
L1
0°
13°
0.27
0.16
-
7°
1.00
0.50 BSC
48
NOM
MILLIMETERS
A1
A2
A
e
0.05
0.95
-
Units
N
MIN
1.05
0.15
1.20
-
-
MAX
Chamfers at corners are optional; size may vary.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
Exposed Pad Length
Exposed Pad Width
D2
E2
3.50 BSC
3.50 BSC



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