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MIC2875 bảng dữ liệu(PDF) 15 Page - Microchip Technology

tên linh kiện MIC2875
Giải thích chi tiết về linh kiện  4.8A ISW, Synchronous Boost Regulator with Bi-Directional Load Disconnect
PDF  24 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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 2015 Microchip Technology Inc.
DS20005549A-page 15
MIC2875
7.0
POWER DISSIPATION
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
device package and the PCB on which the device is
mounted. There is a simple, Ohm’s law-type
relationship between thermal resistance, power
dissipation, and temperature which are analogous to
an electrical circuit (see Figure 7-1):
FIGURE 7-1:
Series Electrical Resistance
Circuit.
From this simple circuit we can calculate VX if we know
ISOURCE, VZ, and the resistor values, RXY and RYZ
using Equation 7-1:
EQUATION 7-1:
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C).
FIGURE 7-2:
Series Thermal Resistance
Circuit.
Now replacing the variables in the equation for VX, we
can find the junction temperature (TJ) from the power
dissipation, ambient temperature and the known
thermal resistance of the PCB (θCA) and the package
(θJC).
EQUATION 7-2:
As can be seen in the diagram, total thermal resistance
θJA = θJC + θCA. This can also be written as in
Equation 7-3:
EQUATION 7-3:
Given that all of the power losses (minus the inductor
losses) are effectively in the converter are dissipated
within the MIC2875 package, PDISS can be calculated
thusly:
EQUATION 7-4:
LINEAR MODE
EQUATION 7-5:
BOOST MODE
EQUATION 7-6:
DUTY CYCLE (BOOST)
In the equations above, ƞ is the efficiency taken from
the efficiency curves and DCR represents the inductor
DCR. θJC and θJA are found in the temperature
specifications section of the data sheet.
Where the real board area differs from 1” square, θCA
(the PCB thermal resistance), values for various PCB
copper areas can be taken from Figure 7-3.
V
X
I
SOURCE
R
XY
R
YZ
+
 V
Z
+
=
T
J
P
DISS
JC
CA
+
 T
A
+
=
T
J
P
DISS
JA
 T
A
+
=
P
DISS
P
OUT
1
---
1
–


I
OUT
2
–
DCR
=
P
DISS
P
OUT
1
---
1
–


I
OUT
1
D
–
-------------


2
–
DCR
=
D
V
OUT
V
IN
–
V
OUT
-------------------------------
+



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