ADPD103BCPZ datasheet(10/53 Pages) AD

10 / 53 page

Data Sheet

ADPD103

Rev. B | Page 9 of 52

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

AVDD to AGND

−0.3 V to +2.2 V

DVDD to DGND

−0.3 V to +2.2 V

INT to DGND

−0.3 V to +2.2 V

PDSO to DGND

−0.3 V to +2.2 V

LEDXx to LGND

−0.3 V to +3.6 V

SCL to DGND

−0.3 V to +3.9 V

SDA to DGND

−0.3 V to +3.9 V

Junction Temperature

150°C

ESD

28-Lead LFCSP

Human Body Model (HBM)

1500 V

Charge Device Model (CDM)

1250 V

Machine Model (MM)

100 V

16-Ball WLCSP

Human Body Model (HBM)

1500 V

Charge Device Model (CDM)

500 V

Machine Model (MM)

100 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 8. Thermal Resistance

Package Type

θJA

Unit

28-Lead LFCSP_WQ

54.9

°C/W

16-Ball WLCSP

°C/W

RECOMMENDED SOLDERING PROFILE

Figure 3 and Table 9 provide details about the recommended

soldering profile.

t25°C TO PEAK

PREHEAT

CRITICAL ZONE

TL TO TP

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

Figure 3. Recommended Soldering Profile

Table 9. Recommended Soldering Profile

Profile Feature

Condition (Pb-Free)

Average Ramp Rate (TL to TP)

3°C/sec max

Preheat

Minimum Temperature (TSMIN)

150°C

Maximum Temperature (TSMAX)

200°C

Time (TSMIN to TSMAX) (tS)

60 sec to 180 sec

TSMAX to TL Ramp-Up Rate

3°C/sec maximum

Time Maintained Above Liquidous

Temperature

Liquidous Temperature (TL)

217°C

Time (tL)

60 sec to 150 sec

Peak Temperature (TP)

+260 (+0/−5)°C

Time Within 5°C of Actual Peak

Temperature (tP)

<30 sec

Ramp-Down Rate

6°C/sec maximum

Time from 25°C to Peak Temperature

8 minutes maximum

ESD CAUTION

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