ADP1763ACPZ-0.9-R7 datasheet(18/19 Pages) AD

18 / 19 page

Data Sheet

ADP1763

Rev. 0 | Page 17 of 18

VIN – VOUT (V)

100

120

140

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

500mA

10mA

100mA

TJ MAX

Figure 44. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP

TB = 92°C

TADP1763 =112°C

Figure 45. Thermal Image of the ADP1763 Evaluation Board at ILOAD = 3 A,

VIN = 1.5 V, VOUT = 1.3 V, TB = 92°C

Figure 45 shows a thermal image of the ADP1763 evaluation

board operating at a 3 A current load. The total power dissipation

on the ADP1763 is 600 mW, which makes the temperature on

the surface of the device higher by 30°C than the temperature of

the evaluation board.

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of ADP1763. However,

as shown in Table 8, a point of diminishing returns is eventually

reached, beyond which an increase in the copper size does not

yield significant heat dissipation benefits.

Use the following recommendations when designing PCBs:



Place the input capacitor as close as possible to the VIN

and GND pins.



Place the output capacitor as close as possible to the VOUT

and GND pins.



Place the soft start capacitor (CSS) as close as possible to the

SS pin.



Place the reference capacitor (CREF) and regulator capacitor

(CREG) as close as possible to the REFCAP pin and VREG pin,

respectively.



Connect the load as close as possible to the VOUT and

SENSE pins.

Use of 0603 or 0805 size capacitors and resistors achieves the

smallest possible footprint solution on boards where area is

limited.

Figure 46. Evaluation Board

Figure 47. Typical Board Layout, Top Side

Figure 48. Typical Board Layout, Bottom Side

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