OPA2613

SBOS249D − JUNE 2003− REVISED APRIL 2004

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4

Boldface limits are tested at +25

°C.

TEST

LEVEL

(3)

OPA2613ID, OPA2613IDTJ

TEST

LEVEL

(3)

MIN/MAX OVER TEMPERATURE

TYP

PARAMETER

TEST

LEVEL

(3)

MIN/

MAX

UNITS

−40

°C to

+85

°C(2)

0

°C to

+70

°C(2)

+25

°C(1)

+25

°C

TEST CONDITIONS

Power Supply

Specified Operating Voltage

±6

V

typ

C

Maximum Operating Voltage Range

±6.3

±6.3

±6.3

V

max

A

Maximum Quiescent Current

VS = ±6V, both channels

12

12.4

12.8

13

mA

max

A

Minimum Quiescent Current

VS = ±6V, both channels

12

11.6

11.2

11

mA

min

A

Power-Supply Rejection Ratio (−PSRR)

Input Referred

95

90

88

87

dB

min

A

Thermal Characteristics

Specified Operating Range D Package

−40 to

+85

°C

typ

C

Thermal Resistance,

qJA

Junction-to-Ambient

DSO

125

°C/W

typ

C

DTJ

PSO

50(6)

°C/W

typ

C

(1) Junction temperature = ambient for +25°C tested specifications.

(2) Junction temperature = ambient at low temperature limit; junction temperature = ambient +23°C at high temperature limit for over temperature

tested specifications.

(3) Test levels: (A) 100% tested at +25°C. Over temperature limits by characterization and simulation. (B) Limits set by characterization and

simulation. (C) Typical value only for information.

(4) Current is considered positive-out-of-node. VCM is the input common-mode voltage.

(5) Tested < 3dB below minimum CMRR specification at ± CMIR limits.

(6) Heat slug soldered to heat spreading plane. This plane should be electrically floating or at VS− voltage.