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LM317EMPX bảng dữ liệu(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
tên linh kiện LM317EMPX
Giải thích chi tiết về linh kiện  3-Terminal Adjustable Regulator
PDF  25 Pages
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nhà sản xuất  NSC [National Semiconductor (TI)]
Trang chủ  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM317EMPX bảng dữ liệu(HTML) 5 Page - National Semiconductor (TI)

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Electrical Characteristics (Note 3)
Specifications with standard type face are for T
J = 25˚C, and those with boldface type apply over full Operating Tempera-
ture Range. Unless otherwise specified, V
IN −VOUT = 5V, and IOUT = 10 mA.
Parameter
Conditions
LM317A
LM317
Units
Min
Typ
Max
Min
Typ
Max
Reference Voltage
1.238
1.250
1.262
V
3V
≤ (V
IN −VOUT)
≤ 40V,
1.225
1.250
1.270
1.20
1.25
1.30
V
10 mA
≤ I
OUT
≤ I
MAX,P
≤ P
MAX
Line Regulation
3V
≤ (V
IN −VOUT)
≤ 40V (Note 4)
0.005
0.01
0.01
0.04
%/V
0.01
0.02
0.02
0.07
%/V
Load Regulation
10 mA
≤ I
OUT
≤ I
MAX (Note 4)
0.1
0.5
0.1
0.5
%
0.3
1
0.3
1.5
%
Thermal Regulation
20 ms Pulse
0.04
0.07
0.04
0.07
%/W
Adjustment Pin Current
50
100
50
100
µA
Adjustment Pin Current
Change
10 mA
≤ I
OUT
≤ I
MAX
0.2
5
0.2
5
µA
3V
≤ (V
IN −VOUT)
≤ 40V
Temperature Stability
T
MIN
≤ T
J
≤ T
MAX
11
%
Minimum Load Current
(V
IN −VOUT) = 40V
3.5
10
3.5
10
mA
Current Limit
(V
IN −VOUT)
≤ 15V
K, T, S Packages
1.5
2.2
3.4
1.5
2.2
3.4
A
H Package
MP Package
0.5
1.5
0.8
2.2
1.8
3.4
0.5
1.5
0.8
2.2
1.8
3.4
A
A
(V
IN −VOUT) = 40V
K, T, S Packages
0.15
0.4
0.15
0.4
A
H Package
MP Package
0.075
0.15
0.2
0.4
0.075
0.15
0.2
0.4
A
A
RMS Output Noise, % of V
OUT
10 Hz
≤ f ≤ 10 kHz
0.003
0.003
%
Ripple Rejection Ratio
V
OUT = 10V, f = 120 Hz,
65
65
dB
C
ADJ =0 µF
V
OUT = 10V, f = 120 Hz,
66
80
66
80
dB
C
ADJ =10 µF
Long-Term Stability
T
J = 125˚C, 1000 hrs
0.3
1
0.3
1
%
Thermal Resistance,
Junction-to-Case
K Package
MDT Package
2.3
5
3
˚C/W
˚C/W
H Package
12
15
12
15
˚C/W
T Package
MP Package
4
23.5
54
23.5
˚C/W
˚C/W
Thermal Resistance,
Junction-to-Ambient (No Heat
Sink)
K Package
MDT Package(Note 6)
35
35
92
˚C/W
˚C/W
H Package
140
140
˚C/W
T Package
50
50
˚C/W
S Package (Note 6)
50
50
˚C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed.
Note 2: Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.
Note 3: Although power dissipation is internally limited, these specifications are applicable for maximum power dissipations of 2W for the TO-39 and SOT-223 and
20W for the TO-3, TO-220, and TO-263. IMAX is 1.5A for the TO-3, TO-220, and TO-263 packages, 0.5A for the TO-39 package and 1A for the SOT-223 Package.
All limits (i.e., the numbers in the Min. and Max. columns) are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 4: Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are
covered under the specifications for thermal regulation.
Note 5: Human body model, 100 pF discharged through a 1.5 k
Ω resistor.
Note 6: If the TO-263 or TO-252 packages are used, the thermal resistance can be reduced by increasing the PC board copper area thermally connected to the
package. Using 0.5 square inches of copper area.
θJA is 50˚C/W; with 1 square inch of copper area, θJA is 37˚C/W; and with 1.6 or more square inches of copper
area,
θJA is 32˚C/W. If the SOT-223 package is used, the thermal resistance can be reduced by increasing the PC board copper area (see applications hints for
heatsinking).
www.national.com
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