TS3USB3200 datasheet(4/23 Pages) TI1

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TS3USB3200

SCDS333B – JUNE 2012 – REVISED JULY 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3)

All voltages are with respect to ground, unless otherwise specified.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VCC ,VBUS

Supply voltage(3)

–0.3

5.5

VI/O

Input/Output DC voltage(3)

–0.5

5.5

Input/Output port diode current

VI/O < 0

–50

Digital input voltage range (SEL1, SEL2, PSEL)

–0.3

5.5

IIK

Digital logic input clamp current(3)

VI < 0

–50

ICC

Continuous current through VCC

100

IGND

Continuous current through GND

–100

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3500

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

2.7

4.3

VBUS

VBUS Supply voltage

4.3

5.5

VI/O (USB)

VI/O (ID)

Analog voltage for USB and ID signal path

3.6

VI/O (MHL)

Analog voltage for MHL signal path

1.6

3.4

Digital input voltage (SEL1, SEL2, PSEL)

VCC

TRAMP (VCC)

Power supply ramp time requirement (VCC)

100

1000

μs/V

TRAMP (VBUS)

Power supply ramp time requirement (VBUS)

100

1000

μs/V

Operating free-air temperature

–40

ºC

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

The package thermal impedance is calculated in accordance with JESD 51-7.

6.4 Thermal Information

THERMAL METRIC(1)

TS3USB3200

UNIT

RSV (UQFN)

16 PINS

RθJA

Junction-to-ambient thermal resistance(2)

109.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

°C/W

RθJB

Junction-to-board thermal resistance

46.4

°C/W

ψJT

Junction-to-top characterization parameter

°C/W

ψJB

Junction-to-board characterization parameter

49.7

°C/W

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