NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

26.01.2015

C1 SERIES

8. SOLDERING AND MOUNTING :

8-1. Recommended PC Board Pattern

L

G

CERAMIC CHIP INDUCTORS

0.45~0.55

GH

Unit:m/m

1.50

L

0.45~0.55

8-2.2 Soldering Iron :

8-2.1 Lead Free Solder Re-flow :

cannot be avoided, the preferred technique is the utilization of hot air soldering tools.

Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering

Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C)

Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a

a) Preheat circuit and products to 150° C.

b) 350° C tip temperature for Ferrite chip bead (max)

c) Never contact the ceramic with the iron tip

soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2.

Note :

8-2. Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 4-5 secs.

d) 1.0mm tip diameter (max)

mechanical stress when warping the board.

PC board should be designed so that products can prevent damage from

Preheating

TP(260° C/40s max.)

60~180s

480s max.

Figure 1. Re-flow Soldering:3 times max

150

25

200

217

Time(sec.)

Within4~5s

Gradual

Cooling

Over 60s.

Figure 2. Wave Soldering:1 times max

cooling

60~150s

20~40s

Soldering

Natural

cooling

150

350

Preheating

Soldering

Natural

Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk

If wave soldering is used ,there will be some risk.

Note.