5

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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com

Specifications are subject to change

Surface Mount UV LED

NUVC66 Series

Item

Dimension (mm)

a

7.44 ± 0.10

b

6.18 ± 0.10

c

1.40 ± 0.10

d

1.40 ± 0.10

e

2.30 ± 0.10

f

3.50 ± 0.10

g

6.18 ± 0.10

h

7.44 ± 0.10

LAND PATTERN DIMENSIONS

Termination

Connection

1

Anode

2

Thermal Pad (Heat Sink)

3

Cathode

Time (seconds)

T

P

T

L

T

smax

T

smin

25°C

Max. Ramp up rate - 3°C/s

Max. Ramp down rate - 6°C/s

Preheat Area

t

P

T

t

L

t

S

Time 25°C to Peak

REFLOW SOLDERING PROFILE

(25°C 30mA)

(60°C,

10mA)

TEMPERATURE DERATING CURVE (Rth j-a = +90°C/W)

(Ambient Temperature vs. Allowable Forward Current)

AMBIENT TEMPERATURE (°C)

40

30

10

60

40

20

0

0

20

c

b

h

f

e

1

2

3

g

d

a

Item

Specification

Preheat (Soak Time)

T

smin

T

smax

T

150°C

200°C

60 ~ 120 sec.

Ramp Up Rate

3°C/sec.

T

217°C

Time above T

L

60 ~ 150 sec.

T

260°C

Time at T

30 sec.

Ramp Down Rate

6°C/sec.

Maximum Time from

25°C to T

P

8 minutes