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NCP4208 bảng dữ liệu(PDF) 4 Page - ON Semiconductor

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NCP4208 bảng dữ liệu(HTML) 4 Page - ON Semiconductor

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NCP4208
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ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage Range
VIN
−0.3 to 6
V
FBRTN
VFBRTN
−0.3 to +0.3
V
PWM2 to PWM8, Rampadj
−0.3 to VIN + 0.3
V
SW1 to SW8
−5 to +25
V
SW1 to SW8 (<200 ns)
−10 to +25
V
All other Inputs and Outputs
−0.3 to VIN + 0.3
V
Storage Temperature Range
TSTG
−65 to 150
°C
Operating Ambient Temperature Range
0 to 85
°C
ESD Capability, Human Body Model
ESDHBM
1.5
kV
ESD Capability, Machine Model
ESDMM
150
V
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions (Note 2)
TSLD
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
1. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Resistance, Junction−to−Air (Note 2)
QFN, 7x7 mm
RqJA
27
°C/W
2. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
Figure 3.
NCP4208 RT vs Frequency
TYPICAL CHARACTERISTICS
0
500
1000
1500
2000
2500
0
100
200
300
400
500
600
700
800
900
RT (kW)
PWM1



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