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NPI_C bảng dữ liệu(PDF) 1 Page - NIC-Components Corp. |
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NPI_C bảng dữ liệu(HTML) 1 Page - NIC-Components Corp. |
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1 / 9 page ![]() 1 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com ® NPI Power Inductors NPI__C Series Series A B C G (Ref) H (Ref) I (Ref) NPI32C 3.50 ± 0.3 3.00 ± 0.3 2.10 ± 0.3 1.1 3.3 1.30 NPI43C 4.50 ± 0.3 4.00 ± 0.3 3.20 ± 0.3 1.5 4.5 1.75 NPI52C 5.80 ± 0.3 5.20 ± 0.3 2.00 ± 0.3 1.7 5.5 2.15 NPI54C 5.80 ± 0.3 5.20 ± 0.3 4.50 ± 0.3 1.7 5.5 2.15 NPI73C 7.80 ± 0.3 7.00 ± 0.3 3.50 ± 0.5 2.0 7.5 3.0 NPI75C 7.80 ± 0.3 7.00 ± 0.3 5.00 ± 0.5 2.0 7.5 3.0 NPI104C 10.0 ± 0.3 9.00 ± 0.3 4.00 ± 0.5 2.5 9.5 3.75 NPI105C 10.0 ± 0.4 9.00 ± 0.4 5.40 ± 0.4 2.5 9.5 3.75 A B 150 G I H I REFLOW SOLDERING LAND PATTERN DIMENSIONS (mm) FEATURES • HIGH CURRENT, SMALL SIZE (UP TO 4 AMPS) • SURFACE MOUNTABLE CONSTRUCTION • HIGH INDUCTANCE (UP TO 820µH) • TAPED AND REELED FOR AUTOMATIC INSERTION • FOR USE IN DC/DC CONVERTERS, DC/AC INVERTERS • Pb-FREE COMPATIBLE CHARACTERISTICS Case Size NPI32C NPI43C NPI52C NPI54C NPI73C NPI75C NPI104C NPI105C Inductance Range 1 ~ 100µH 1 ~ 220µH 1 ~ 560µH 1 ~ 680µH 10 ~ 330µH 10 ~ 470µH 10 ~ 560µH 10 ~ 820µH Inductance Tolerance 10% (K), 20% (M) Ambient Operating Temperature Range -40°C ~ +85°C* Maximum Component Temperature (Ambient + Self-Heating) +125°C* Inductance Change at Isat -30% max. Temperature Raise at Irms +40°C max. Resistance to Solder Heat 260°C for 10 seconds C REFLOW SOLDERING PROFILE Soldering 260°C max. 5 seconds max. Cool Down 60 ~ 120 sec. 25 50 100 150 200 250 300 Pre-Heat 150°C ~ 180°C Time above 230°C 30 seconds max. 30 60 90 120 150 180 210 240 270 300 Time - Seconds NPI 43 C 4R7 M TR F RoHS Compliant Packaging: TR = Tape & Reel Inductance Tolerance Code: M=±20% Inductance Code (µH): 1st two digits are significant, 3rd digit is multiplier for values from 10µH and up. Construction Code (see drawing for details) Size Code (see table for details) Series PART NUMBER SYSTEM *See Part Number System for Details RoHS Compliant includes all homogeneous materials Termination Plating Sn 96.5% - Ag 3.0% - Cu 0.5% |
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Mô tả tương tự - NPI_C |
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