CD54HC4066 datasheet(3/14 Pages) TI

3 / 14 page

Absolute Maximum Ratings

Thermal Information

DC Supply Voltage, VCC

HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V

HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 10.5V

DC Input Diode Current, IIK

For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA

DC Switch Current, IO (Note 1)

For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA

DC Output Diode Current, IOK

For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Source or Sink Current per Output Pin, IO

For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA

DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA

Operating Conditions

Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55

oC to 125oC

Supply Voltage Range, VCC

HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 10V

HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V

DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC

Input Rise and Fall Time

2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)

4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)

6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)

Thermal Resistance (Typical, Note 2)

θJA

E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .

80oC/W

M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .

86oC/W

PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . .

113oC/W

Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC

Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTES:

1. In certain applications, the external load-resistor current may include both VCC and signal-line components. To avoid drawing VCC current

when switch current flows into the transmission gate inputs, (terminals 1, 4, 8 and 11) the voltage drop across the bidirectional switch

must not exceed 0.6V (calculated from RON values shown in the DC Electrical Specifications Table). No VCC current will flow through

RLif the switch current flows into terminals 2, 3, 9 and 10.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Speciﬁcations

PARAMETER

SYMBOL

TEST

CONDITIONS

VCC (V)

25oC

-40oC TO 85oC

-55oC TO 125oC

UNITS

VI (V)

VIS (V)

MIN

TYP

MAX

MIN

MAX

MIN

MAX

HC TYPES

High Level Input

Voltage

VIH

1.5

4.5

3.15

6.3

Low Level Input

Voltage

VIL

0.5

4.5

1.35

2.7

Input Leakage

Current

(Any Control)

IIL

VCC or

GND

-10

±0.1

±1-

±1

µA

Off-Switch Leakage

Current

VIL

VCC or

GND

±0.1

±1-

±1

µA

CD54HC4066, CD74HC4066, CD74HCT4066

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