SY89834U datasheet(3/10 Pages) MICREL

3 / 10 page

PRELIMINARY

Precision Edge™

SY89834U

Micrel

Absolute Maximum Ratings(Note 1)

Supply Voltage (V

CC) .................................. –0.5V to +4.0V

Input Voltage (V

IN) ............................... –0.5V to VCC +0.3V

ECL Output Current (I

OUT)

Continuous ............................................................. 50mA

Surge .................................................................... 100mA

Input Current (IN1, IN2) ............................................

±50mA

Lead Temperature (Soldering, 10sec.), ................... 220

°C

Storage Temperature (T

S) ....................... –65°C to +150°C

Operating Ratings(Note 2)

Supply Voltage Range .......................... +2.375V to +3.63V

Ambient Temperature (T

A) ......................... –40°C to +85°C

Package Thermal Resistance

MLF™

(θ

JA)

Still-Air ............................................................. 60

°C/W

500lfpm ............................................................ 54

°C/W

MLF™

(ψ

JB) Junction-to-Board, Note 3 .............. 32°C/W

A = –40°C to +85°C

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Voltage Range

2.375

3.63

Power Supply Current

No load, maximum supply voltage

Input Voltage Swing

see Figures 2a–2b.

0.1

DIFF_IN

Input Differential Swing

see Figures 2a–2b.

0.2

Note 1.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The circuit is in a

test socket or mounted on a printed circuit board and airflow greater than 500lfpm is maintained.

Note 2.

Specification for packaged product only.

DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)

Note 1.

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG

conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

CC = 2.5V ±5% or VCC = 3.3V ±10% , TA = –40°C to +85°C

Symbol

Parameter

Condition

Min

Typ

Max

Units

Input HIGH Voltage

2.0

Input LOW Voltage

0.8

Input HIGH Current

–125

µA

Input LOW Current

–300

µA

Note 1.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

Note 2.

Specification for packaged product only.

CC = 2.5V ±5% or VCC = 3.3V ±10% , TA = –40°C to +85°C

Symbol

Parameter

Condition

Min

Typ

Max

Units

Output HIGH Voltage

L = 50Ω to VCC–2V

CC–1.145 VCC–1.020 VCC–0.895

Output LOW Voltage

L = 50Ω to VCC–2V

CC–1.945 VCC–1.820 VCC–1.695

OUT

Output Voltage Swing

see Figures 2a–2b.

550

800

1050

DIFF_OUT

Differential Output Voltage Swing

see Figures 2a–2b.

1100

1600

2100

Note 1.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

Note 2.

Specification for packaged product only.

LVTTL/CMOS INPUTS DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)

(100KEP) LVPECL OUTPUTS DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)

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