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EXAMPLE BOARD LAYOUT

9X (

0.23)

(0.4) TYP

(0.4) TYP

(

0.23)

METAL

0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(

0.23)

SOLDER MASK

OPENING

0.05 MIN

DSBGA - 0.625 mm max height

YFF0009

DIE SIZE BALL GRID ARRAY

4219552/A 05/2016

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,

see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:30X

C

1

2

3

A

B

NON-SOLDER MASK

DEFINED

(PREFERRED)

NOT TO SCALE

SOLDER MASK DETAILS

SOLDER MASK

DEFINED

31

TPS61253, TPS61254, TPS61256, TPS61258, TPS61259, TPS612592

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SLVSAG8G – SEPTEMBER 2011 – REVISED JUNE 2016

Product Folder Links: TPS61253 TPS61254 TPS61256 TPS61258 TPS61259 TPS612592

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