OPA348

OPA2348

OPA4348

SBOS213G – NOVEMBER 2001 – REVISED MARCH 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this

document, or visit the device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

Supply Voltage, V– to V+

7.5

V

(V–) – 0.5 to (V+) + 0.5

V

10

mA

Continuous

Operating Temperature

–65 to +150

°C

Storage Temperature

–65 to +150

°C

Junction Temperature

150

°C

Lead Temperature (soldering, 10s)

300

°C

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only. Functional operation of the device at these conditions, or beyond the specified

operating conditions, is not implied.

(2)

Input terminals are not diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails

should be current-limited to 10mA or less.

(3)

Short-circuit to ground, one amplifier per package.

2

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