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List

List.................................................................................................

Package outline...............................................................................

Features..........................................................................................

Maximum ratings .............................................................................

Rating and characteristic curves........................................................

Pinning information...........................................................................

Marking...........................................................................................

Suggested solder pad layout.............................................................

Packing information..........................................................................

Reel packing....................................................................................

Suggested thermal profiles for soldering processes.............................

High reliability test capabilities...........................................................

Mechanical data...............................................................................

Drive NPN Transistor

Formosa MS

FMBTA05 / FMBTA06

Document ID

Issued Date

Revised Date

Revision

Page.

DS-231111

2008/02/10

2011/07/21

C

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