MCP1700-1802ESLASHTO datasheet(8/28 Pages) MICROCHIP

tên linh kiện	MCP1700-1802E/TO

Giải thích chi tiết về linh kiện	Low Quiescent Current LDO

PDF	28 Pages

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nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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MCP1700

DS20001826C-page 8

 2005-2013 Microchip Technology Inc.

Note: Unless otherwise indicated: VR =1.8V, COUT = 1 µF Ceramic (X7R), CIN = µF Ceramic (X7R), IL =100 µA,

TA =+25°C, VIN =VR +1V.

FIGURE 2-19:

Dynamic Load Step

(VR =2.8V).

FIGURE 2-20:

Dynamic Load Step

(VR =1.8V).

FIGURE 2-21:

Dynamic Load Step

(VR =2.8V).

FIGURE 2-22:

Dynamic Load Step

(VR =5.0V).

FIGURE 2-23:

Dynamic Line Step

(VR =2.8V).

FIGURE 2-24:

Start-up from VIN

(VR =1.2V).

VIN =3.8V

VR =2.8V

I= 100 mA

Load

Step

CIN = 1µF Ceramic

COUT = 1µF Ceramic

VIN =2.8V

VR =1.8V

IOUT= 200 mA

Load Step

CIN = 1 µF Ceramic

COUT =22 µF (1 ESR)

VIN =3.8V

VR =2.8V

IOUT=200 mA

Load Step

COUT =22 µF (1 ESR)

CIN =1 µF Ceramic

VIN =6V

VR =5V

IOUT= 200 mA

Load Step

COUT =22 µF (1 ESR)

CIN = 1 µF Ceramic

VIN =3.8V to

4.8V

VR =2.8V

IOUT

100 mA

COUT =1 µF Ceramic

VIN =0V to

2.2V

VR =1.2V

COUT = 1 µF Ceramic

RLOAD =25

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