MCP2200T-ISLASHSS datasheet(34/44 Pages) MICROCHIP

tên linh kiện	MCP2200T-I/SS

Giải thích chi tiết về linh kiện	USB 2.0 to UART Protocol Converter with GPIO

PDF	44 Pages

Scroll/Zoom	100%

nhà sản xuất	MICROCHIP [Microchip Technology]

Trang chủ	http://www.microchip.com

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34 / 44 page

MCP2200

DS20002228C-page 34

 2011-2015 Microchip Technology Inc.

RECOMMENDED LAND PATTERN

Microchip Technology Drawing C04-2139B (MQ)

20-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5x1.0 mm Body [VQFN]

SILK SCREEN

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

3.35

MILLIMETERS

0.65 BSC

MIN

MAX

4.50

Contact Pad Length (X20)

Contact Pad Width (X20)

0.55

0.40

Distance Between Pads

0.20

NOM

With 0.40 mm Contact Length

ØV

MCP2200T-I/SS bảng dữ liệu(PDF) 34 Page - Microchip Technology