LP8727TMXSLASHNOPB datasheet(4/33 Pages) TI1

4 / 33 page

LP8727

SNVS898A – OCTOBER 2012 – REVISED MAY 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2) (3) (4)

INPUT VOLTAGE

VBUS to GND

−0.3V to +28V

VBAT, EXPDET, CAP [wrt. GND]

−0.3V to +6.0V

SCL, SDA, INT\, DSS [wrt. GND]

−0.3V to (VVBAT+0.3V)

CP_EN = 1

D+, D

−, AUD1, AUD2

−2.1V to (VSWPOS) + 0.3V)

DP, DN, U1, U2, ID, MIC, RES

−0.3V to (VSWPOS) + 0.3V)

CP_EN = 0

D+, D

−, DP, DN, AUD1, RES

−0.3V to (VCC + 0.3V)

AUD2, U1, U2, ID, MIC

TEMPERATURE

Junction Temperature (TJ-MAX)

150°C

Storage Temperature Range

−65 to 150°C

Maximum Lead

260°C

Temperature(Soldering, 10 sec.)

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device fro permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C. Also engages at 160°C and disengages 115°C.

Operating Ratings

(1) (2)

INPUT VOLTAGE

VBAT

2.5V to 5.5V

VBUS

3.5V to 7V

TEMPERATURE

Junction Temperature (TJ) Range

−40°C to 125°C

Ambient Temperature (TA) Range

(3)

−40°C to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to

be de-rated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), The

maximum power dissipation of the device in the application (PD-MAX) and the junction to ambient thermal resistance of the package

(

θJA) in the application, as given by the following equation: TA-MAX = TJ-MAX (θJA x PD-MAX). Due to the pulsed nature of testing the

part, the temp in the Electrical Characteristic table is specified as TA = TJ.

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