SOLDERABLE ENDS

D2

D2=D1

＋0

－0.20

0.5± 0.1

0.5± 0.1

4.9± 0.2

FEATURES

◇ Glass passivated device

◇ Ideal for surface mouted applications

◇ Low leakage current

◇ Metallurgically bonded construction

MECHANICAL DATA

◇ Case:JEDEC DO-213AB,molded plastic over

passivated chip

◇ Terminals:Solder Plated, solderable per

MIL-STD-750, Method 2026

◇ Polarity: Color band denotes cathode end

◇ Weight: 0.0046 ounces, 0.116 gram

◇ Mounting position: Any

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase,half wave,60Hz,resistive or inductive load.For capactive load,derate current by 20%.

513

516

518

2000

Maximum recurrent peak reverse voltage

V

Maximum RMS voltage

V

Maximum DC blocking voltage

V

Maximum average forword

rectified current

Peak forward surge current 8.3ms single

half-sine-wave superimposed

on rated load (JEDEC method)

Maximum forward voltage at 1.0A

V

Maximum DC reverse current

Typical junction capacitance (NOTE 1)

pF

Typical thermal resistance

(NOTE 2)

℃/W

Typical thermal resistance

(NOTE 3)

℃/W

Operating temperature range

℃

Storage temperature range

℃

2. Thermal resistance junction to lead, 6.0 mm

3. Thermal resistance junction to ambient, 6.0 mm

REVERSE VOLTAGE:

1300-2000V

1.1

SM

SM

SM

- 55 --- + 175

A

CURRENT: 1.0 A

DO - 213AB

910

1120

1260

1400

1300

1600

1800

2000

SURFACE MOUNT RECTIFIER

S

μA

15

SM513 --- SM2000

40

20

50

UNITS

SM

50

1300

1600

1800

2000

5.0

NOTES:1. Measured at 1.0MHz and applied average voltage of 4.0V DC.

A

- 55 --- + 175

1.0

Dimensions in millimeters

Diode Semiconductor Korea

www.diode.kr