LP3988

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SNVS161E – OCTOBER 2001 – REVISED OCTOBER 2015

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

NOM

MAX

UNIT

6

V

0

V

0

6

V

0

500

µA

–40

125

°C

SOT-23

322

mW

DSBGA

303

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

(4)

Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The

322-mW rating appearing under Recommended Operating Conditions for the SOT-23-5 package results from substituting the maximum

ambient temperatures below 70°C . Less power can be dissipated at ambient temperatures above 70°C. The maximum power

dissipation for operation can be increased by 4.5 mW for each degree below 70°C, and it must be derated by 5.86 mW for each degree

above 70°C. The same principle applies to the DSBGA package.

6.4 Thermal Information

LP3988

DBV (SOT-23)

YZR (DSBGA)

UNIT

5 PINS

5 PINS

Junction-to-ambient thermal resistance

170.5

181.2

°C/W

Junction-to-case (top) thermal resistance

124.4

0.8

°C/W

Junction-to-board thermal resistance

30.9

107.9

°C/W

Junction-to-top characterization parameter

17.6

0.5

°C/W

Junction-to-board characterization parameter

30.4

107.9

°C/W

Junction-to-case (bottom) thermal resistance

n/a

n/a

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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