LP3990

SNVS251J – MAY 2004 – REVISED SEPTEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2) (3)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

–0.3

6.5

Output voltage

–0.3

V

ENABLE input voltage

–0.3

6.5

Continuous power dissipation internally limited

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

(5)

Internal thermal shutdown circuitry protects the device from permanent damage.

6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

Charged device model (CDM), per JEDEC specification JESD22-

V

250

1500

C101, all pins

Machine model

–200

200

(1)

JEDEC document JEP155 states that 2000-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2

6

V

0.0

(1)

–40

125

°C

(1)

6.4 Thermal Information

LP3990

YZR (DSBGA) DBV (SOT-23)

NGG (WSON)

UNIT

4 PINS

5 PINS

6 PINS

Junction-to-ambient thermal resistance

188.9

165.2

53.9

Junction-to-case (top) thermal resistance

1.0

69.9

51.2

Junction-to-board thermal resistance

105.3

27.3

28.2

°C/W

Junction-to-top characterization parameter

0.7

1.8

0.6

Junction-to-board characterization parameter

105.2

26.8

28.3

Junction-to-case (bottom) thermal resistance

N/A

N/A

8.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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