LP3933 datasheet(5/18 Pages) NSC

5 / 18 page

Electrical Characteristics (Notes 2, 11) (Continued)

Note 9: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power

dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA-MAX =TJ-MAX-OP −(θJA xPD-MAX).

Note 10: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,

special care must be paid to thermal dissipation issues in board design.

Note 11: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 12: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) are used in setting electrical characteristics.

Note 13: VREF pin (Bandgap reference output) is for internal use only. A capacitor should always be placed between VREF and GND1.

Note 14: ESD susceptibility for pin 11 and 12 is 500V for the human body model and 150V for the machine model.

Block Diagram

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