TLC2872Z, TLC2872Y

Advanced LinCMOS

™ RAIL-TO-RAIL

DUAL OPERATIONAL AMPLIFIERS

SLOS117 – OCTOBER 1992

2

POST OFFICE BOX 655303

description (continued)

The inputs and outputs of this device are designed to withstand 100-mA surge current without sustaining

latch-up. In addition, internal ESD-protection circuits prevent functional failures up to 2000 V. The device is

characterized for operation over the extended (Z) temperature range of – 40

°C to 150°C.

TLC2872Y chip information

This chip, when properly assembled, displays characteristics similar to TLC2872Z. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

+

–

1OUT

1 IN +

1IN –

VCC+

(8)

(6)

(3)

(2)

(5)

(1)

–

+

(7)

2IN +

2IN –

2OUT

(4)

VCC –

56

67

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)