LP3907 datasheet(6/58 Pages) TI1

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LP3907

SNVS511S – JUNE 2007 – REVISED APRIL 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions (Bucks). Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP − (RθJA × PD-MAX).

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, SDA, SCL

–0.3

GND to GND SLUG

±0.3

Power dissipation (WQFN (RTW))(PD_MAX)

(TA = 85°C, TMAX = 125°C )

(3)

1.43

Power dissipation (DSBGA (YZR))(3) (PD_MAX)

(TA = 85°C, TMAX = 125°C )

0.78

Junction temperature, TJ-MAX

150

°C

Maximum lead temperature (soldering)

260

°C

Storage temperature, Tstg

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±750

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Minimum (Minimum) and Maximum (Maximum) limits are ensured by design, test, or statistical analysis. Typical numbers are not

ensured, but do represent the most likely norm.

(4)

Buck VIN ≥ VOUT + 1 V.

(5)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

7.3 Recommended Operating Conditions (Bucks)

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3) (4)

MIN

MAX

UNIT

VIN

2.8

5.5

VEN

(VIN + 0.3 V)

Junction temperature, TJ

−40

125

°C

Ambient temperature, TA

(5)

−40

°C

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