LP2998, LP2998-Q1

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SNVS521K – DECEMBER 2007 – REVISED AUGUST 2014

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVIN to GND

−0.3

6

V

PVIN to GND

–0.3

AVIN

V

−0.3

6

V

Junction temperature

150

°C

Lead temperature (soldering, 10 sec)

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

VDDQ voltage must be less than 2 x (AVIN - 1) or 6V, whichever is smaller.

7.2 Handling Ratings: LP2998

MIN

MAX

UNIT

Storage temperature range

−65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

Electrostatic discharge

−1000

1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Handling Ratings: LP2998-Q1

MIN

MAX

UNIT

Storage temperature range

−65

150

°C

Electrostatic discharge

−1000

1000

V

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. The LP2998-Q1 is

rated at AEC-Q100 ESD HBM Classification Level H1C.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

–40

125

°C

AVIN to GND

2.2

5.5

V

PVIN supply voltage

0

AVIN

V

SD input voltage

0

AVIN

V

(1)

At elevated temperatures, devices must be derated based on thermal resistance.

7.5 Thermal Information

LP2998/LP2998-Q1

LP2998

SO PowerPAD

SOIC

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

43

151

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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