LP3470 datasheet(4/22 Pages) TI1

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LP3470

SNVS003G – JUNE 1999 – REVISED APRIL 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is PDmax = (TJmax − TA)/ θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VCC voltage

–0.3

Reset voltage

–0.3

Output current (Reset)

Power dissipation (TA = 25°C)

(3)

300

Lead temperature (soldering, 5 sec)

260

°C

Junction temperature, TJMAX

125

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Operating voltage

0.5

5.5

Operating temperature

LP3470

–20

°C

LP3470I

–40

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

LP3470

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

171

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

124.8

°C/W

RθJB

Junction-to-board thermal resistance

30.9

°C/W

ψJT

Junction-to-top characterization parameter

17.9

°C/W

ψJB

Junction-to-board characterization parameter

30.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W

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