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LP2996AMRE/NOPB bảng dữ liệu(PDF) 6 Page - Texas Instruments |
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LP2996AMRE/NOPB bảng dữ liệu(HTML) 6 Page - Texas Instruments |
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6 / 29 page ![]() LP2996A SNOSCY7 – JUNE 2014 www.ti.com Electrical Characteristics (continued) Specifications are for TJ = 25°C and apply over the full Operating Temperature Range (TJ = 0°C to +125°C) (1). Unless otherwise specified, AVIN = PVIN = 2.5V, VDDQ = 2.5V (2). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VTT Output Voltage (DDR III) (3) IOUT = 0A, AVIN = 2.5 V PVIN = VDDQ = 1.35V 0.656 0.677 0.698 PVIN = VDDQ = 1.5 V 0.731 0.752 0.773 PVIN = VDDQ = 1.6 V 0.781 0.802 0.823 IOUT = +0.2A, AVIN = 2.5V 0.667 0.688 0.710 PVIN = VDDQ = 1.35V IOUT = -0.2A, AVIN = 2.5V 0.641 0.673 0.694 PVIN = VDDQ = 1.35V V IOUT = +0.4 A, AVIN = 2.5 V 0.740 0.763 0.786 PVIN = VDDQ = 1.5 V IOUT = –0.4 A, AVIN = 2.5 V 0.731 0.752 0.773 PVIN = VDDQ = 1.5 V IOUT = +0.5A, AVIN = 2.5 V 0.790 0.813 0.836 PVIN = VDDQ = 1.6 V IOUT = -0.5 A, AVIN = 2.5 V 0.781 0.802 0.823 PVIN = VDDQ = 1.6 V VOSVtt IOUT = 0 A –30 0 30 VTT Output Voltage Offset (VREF – IOUT = –1.5 A –30 0 30 VTT) for DDR I (3) IOUT = 1.5 A –30 0 30 VTT Output Voltage Offset (VREF – IOUT = 0 A –30 0 30 VTT) for DDR II (3) IOUT = –0.5 A –30 0 30 mV IOUT = 0.5 A –30 0 30 VTT Output Voltage Offset (VREF – IOUT = 0 A –30 0 30 VTT) for DDR III (3) IOUT = ±0.2 A –30 0 30 IOUT = ±0.4 A –30 0 30 IOUT = ±0.5 A –30 0 30 IQ Quiescent Current (4) IOUT = 0 A 320 500 µA ZVDDQ VDDQ Input Impedance 100 k Ω ISD Quiescent current in shutdown (4) SD = 0 V 115 150 µA IQ_SD Shutdown leakage current SD = 0 V 2 5 VIH Minimum Shutdown High Level 1.9 V VIL Maximum Shutdown Low Level 0.8 SD = 0 V Iv VTT leakage current in shutdown 1 10 µA VTT = 1.25 V ISENSE VSENSE Input current 13 nA TSD Thermal Shutdown (5) 165 °C TSD_HYS Thermal Shutdown Hysteresis 10 (4) Quiescent current defined as the current flow into AVIN. (5) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature and the regulator will go into thermal shutdown. 6 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LP2996A |
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