THS7002IPWPRG4 datasheet(30/41 Pages) TI1

30 / 41 page

THS7001, THS7002

70MHz PROGRAMMABLEGAIN AMPLIFIERS

SLOS214C − OCTOBER 1998 − REVISED MARCH 2007

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

general PowerPAD design considerations (continued)123456

The actual thermal performance achieved with the THS7001PWP/THS7002PWP in its PowerPAD package

depends on the application. In the example above, if the size of the internal ground plane is approximately

3 inches

× 3 inches (76,2 mm x 76.2 mm), then the expected thermal coefficient, θJA, is about 32.6°C/W for the

THS7001 and 27.9

_C/W for the THS7002. For a given θJA, the maximum power dissipation is shown in Figure

69 and is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of THS7001 and THS7002 IC (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case (THS7001 = 1.4°C/W; THS7002 = 0.72°C/W)

θCA = Thermal coefficient from case to ambient air (°C/W)

THS7002

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

−40

−20

TA − Free-Air Temperature − _C

100

TJ = 150 _C

θJA = 27.9 _C/W

2 oz. Trace and

Copper Pad With

Solder

θJA = 56.2 _C/W

2 oz. Trace and

Copper Pad

Without Solder

THS7001

MAXIMUM POWER DISSIPATION

FREE-AIR TEMPERATURE

−40

−20

TA − Free-Air Temperature − _C

100

TJ = 150 _C

θJA = 32.6 _C/W

2 oz. Trace and

Copper Pad With

Solder

θJA = 74.4 _C/W

2 oz. Trace and

Copper Pad

Without Solder

NOTE A: Results are with no air flow and PCB size = 3”

× 3” (76,2 mm x 76,2 mm)

Figure 69. Maximum Power Dissipation vs Free-Air Temperature

More complete details of the PowerPAD installation process and thermal management techniques can be found

in the Texas Instruments technical brief, PowerPAD Thermally Enhanced Package. This document can be found

at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered

through your local TI sales office. Refer to literature number SLMA002 when ordering.

evaluation board

An evaluation board is available both the THS7001 (literature number SLOP250) and for the THS7002

(literature number SLOP136). These boards has been configured for very low parasitic capacitance in order

to realize the full performance of the amplifiers. These EVM’s incorporate DIP switches to demonstrate the full

capabilities of the THS7001 and THS7002 independent of any digital control circuitry. For more information,

please refer to the THS7001 EVM User’s Guide (literature number SLOU057)and the THS7002 EVM User’s

Guide (literature number SLOU037). To order a evaluation board contact your local TI sales office or distributor.

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