LMC6035IMSLASHNOPB datasheet(2/29 Pages) TI1

2 / 29 page

LMC6035, LMC6035-Q1, LMC6036

SNOS875G – JANUARY 2000 – REVISED APRIL 2013

www.ti.com

Table 1. DSBGA Connection Table

LM6035IBP

LMC6035ITL

Bump Number

LMC6035IBPX

LMC6035ITLX

OUTPUT A

OUTPUT B

IN A−

V+

IN A+

OUTPUT A

V−

IN A−

IN B+

IN A+

IN B−

V−

OUTPUT B

IN B+

V+

IN B−

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

ESD Tolerance(3)

Human Body Model (LMC6035, LMC6036)

3000V

Human Body Model (LMC6035-Q1)

2000V

Machine Model

300V

Differential Input Voltage

± Supply Voltage

Supply Voltage (V+

− V−)

16V

Output Short Circuit to V +

See(4)

Output Short Circuit to V −

See(5)

Lead Temperature (soldering, 10 sec.)

260°C

Current at Output Pin

±18mA

Current at Input Pin

±5mA

Current at Power Supply Pin

35mA

Storage Temperature Range

−65°C to +150°C

Junction Temperature(6)

150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

Human body model, 1.5k

Ω in series with 100pF.

(4)

Do not short circuit output to V+ when V+ is greater than 13V or reliability will be adversely affected.

(5)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of 30mA over long term may adversely affect

reliability.

(6)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) −TA)/θ JA. All numbers apply for packages soldered directly onto a PC board with no air flow.

Operating Ratings

(1)

Supply Voltage

2.0V to 15.5V

Temperature Range

LMC6035I and LMC6036I

−40°C ≤ T J ≤ +85°C

Thermal Resistance (

θJA)

8-pin VSSOP

230°C/W

8-pin SOIC

175°C/W

14-pin SOIC

127°C/W

14-pin TSSOP

137°C/W

8-Bump (6 mil) DSBGA

220°C/W

8-Bump (12 mil) Thin DSBGA

220°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

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