LMH6723MASLASHNOPB datasheet(19/28 Pages) TI1

19 / 28 page

LMH6723, LMH6724

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SNOSA83I – AUGUST 2003 – REVISED AUGUST 2014

8 Power Supply Recommendations

Follow these steps to determine the maximum power dissipation for the LMH6723/LMH6724:

1. Calculate the quiescent (no-load) power: PAMP = ICC * (VS)

where VS = V

+ - V-

2. Calculate the RMS power dissipated in the output stage: PD (rms) = rms ((VS-VOUT)*IOUT) where VOUT and

IOUT are the voltage and current of the external load and Vs is the supply voltage.

3. Calculate the total RMS power: PT = PAMP +PD

The maximum power that the LMH6723/LMH6724 package can dissipate at a given temperature can be derived

with the following equation:

PMAX = (150º - TAMB)/ RθJA

where

•

TAMB = Ambient temperature (°C)

•

RθJA = Thermal resistance, from junction to ambient, for a given package (°C/W)

(1)

For the SOIC-8 package RθJA is 166°C/W and for the SOT-23-5 it is 230°C/W.

8.1 ESD Protection

The LMH6723/LMH6724 is protected against electrostatic discharge (ESD) on all pins. The LMH6723 will survive

2000V Human Body Model or 200V Machine Model events.

Under closed loop operation the ESD diodes have no effect on circuit performance. There are occasions,

however, when the ESD diodes will be evident. If the LMH6723/LMH6724 is driven into a slewing condition the

ESD diodes will clamp large differential voltages until the feedback loop restores closed loop operation. Also, if

the device is powered down and a large input signal is applied, the ESD diodes will conduct.

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