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UPD720122 bảng dữ liệu(PDF) 79 Page - NEC

tên linh kiện UPD720122
Giải thích chi tiết về linh kiện  MOS Integrated Circuit
PDF  82 Pages
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nhà sản xuất  NEC [NEC]
Trang chủ  http://www.nec.com/
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UPD720122 bảng dữ liệu(HTML) 79 Page - NEC

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Data Sheet S16685EJ2V0DS
79
µPD720122
4.
RECOMMENDED SOLDERING CONDITIONS
The
µPD720122 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact your NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
•
µµµµ PD720122GC-9EU : 100-pin plastic TQFP (Fine pitch) (14 ×××× 14)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note (after that, prebake at 125°C for 10 hours)
IR35-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
•
µµµµ PD720122F1-GN2 : 109-pin plastic FBGA (11 ×××× 11)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Three times or less
Exposure limit: 3 days
Note (after that, prebake at 125°C for 10 hours)
IR35-103-3
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.



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